求人番号：71766
企業名非公開
Principal Engineer, BE OSAT Package Develop Engineer
- 業種
- 半導体メーカー
- 職種
- 技術系（電気・電子・半導体・機械・自動車）スペシャリスト その他
- 年収
- 1,100万円～1,400万円
- 勤務地
- 東京都
外資系企業
大手企業
海外出張
英語力が必要
リモートワーク可
- 仕事内容：
- OSAT Development, Package Design and Development function (PAD)
* Responsible for package design tasks in OSAT segment.
* Manage package development execution within product and technology according to project requirement.
1. Responsible for package development tasks as PAD function in OSAT :package definition, technology integration and project management for ATV and CCS business groups.
2.Own package design stage development milestone. Accountable to the project PJM.
3. Align on chip / package development, test concept for all technical, cost and quality during definition.
4. Define and select package solution according to product requirement (package type and BOM)
5.Tool up PRP, QTP, DFMEA. Project schedule, and alignment
6. Perform project risk assessment and mitigation actions.
7. Project complexity definition with Delta list, Project category assessment
8. As a driver or co-driver for platform related Task force activities.